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3D SiPCBAdvantages

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Adopt Exsisting Technology

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Wide Technology Integration

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Design Reuse ROI Diversity

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Overall System Cost Reduction

3D stacking methods with exsiting technologies. Ease of adoption with minimal risk is a win-win to mate various IC designs along with PCB's using available via through silicon technolgies and silicon or PCB interposer layers.

Wide Technology Integration. combine any number of technolgy and process nodes for a complete solution, Use state of the art fab nodes for high speed processing, DSP, etc. Use more mature, larger feature size foundry nodes for mixed signal, Image sensors, etc.

Reuse ROI Diversity. Much like module prodcuts used to design systmes, IC's can be designed for reuse in multiple 3D stacked products,and enjoy the same advantages.

Overall System Cost Reduction. Reuse, reduced power, reduced footprint, and the reduction in reliance of funding develpment of new foundry technologys result in cost savings for reduced footprint and product integration.



Stacking of Integrated circuits alone or in combination of PCB's or ceramic substrates greatly reduce final assembly footprint
With IO lengths severly reduced in comparison to typical PCB assemblies, there is a reduction in signal loading, futher reducing needed IO drive, and especailly useful reduction in high speed clock propigation over long lengths.
Although heat is concentrated in a smaller footprint, the reduction in power requirements in driving shorter nets will result in overall lower system generated thermals.